Charles W Fulton

20140055156, Feb 27, 2014

Aug 27, 2012

13/595903

John C. JOHNSON - Phoenix AZ, US
Charles FULTON - Queen Creek AZ, US
Philip R. MARTIN - Chandler AZ, US
Kent M. CARRIE - Gilbert AZ, US

G01R 31/26

32475415

Provided are a method and system for using fluid to position a device in a socket for testing. The device is positioned within a socket and a body is coupled to the socket. Fluid is delivered to a chamber defined in part by the body, a first surface of the device to provide pressure onto the device to move the device within the socket.

20150276798, Oct 1, 2015

Mar 28, 2014

14/229808

David Won-jun Song - Chandler AZ, US
Christopher Roy Schroeder - Gilbert AZ, US
Joseph Walczyk - Tigard OR, US
Lothar Kress - Portland OR, US
Todd Michael Young - Gilbert AZ, US
Robert Levi Bennett - Hillsboro OR, US
Arun Krishnamoorthy - Portland OR, US
Paul Jonathan Diglio - Beaverton OR, US
Charles Clifton Fulton - Phoenix AZ, US
Sruti Chigullapalli - Chandler AZ, US

G01R 1/04
G01R 31/26

Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.