Carol A Gamlen

6738600, May 18, 2004

Aug 4, 2000

09/632701

Charles M. Newton - Palm Bay FL
Raymond C. Rumpf - Melbourne FL
Carol Gamlen - Melbourne FL

Harris Corporation - Melbourne FL

H04B 338

455 661, 455 74, 455344, 430311, 333204, 428210, 428213, 438 48

A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

6809424, Oct 26, 2004

Dec 19, 2000

09/741754

Randy T. Pike - Indian Harbour Beach FL
Charles M. Newton - South East Palm Bay FL
Carol Gamlen - Melbourne FL
Raymond C. Rumpf - Melbourne FL
Betty ODowd - Melbourne FL

Harris Corporation - Melbourne FL

H01L 2348

257782

A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

6972955, Dec 6, 2005

Sep 25, 2003

10/670480

Michael David Pleskach - Orlando FL, US
Paul Bryant Koeneman - Palm Bay FL, US
Brian Ronald Smith - Pittsburgh PA, US
Charles Michael Newton - Palm Bay FL, US
Carol Ann Gamlen - Melbourne FL, US

Harris Corporation - Melbourne FL

H05K007/20
H25K003/34
H01L021/44

361689, 361688, 137884, 422100, 438122

An electro-fluidic device may include a substrate having at least one substrate fluid passageway therein, and at least one substrate electrical conductor carried by the substrate. Moreover, an external interface may be spaced from the substrate and include at least one interface electrical conductor. The electro-fluidic device may also include at least one electro-fluidic interconnect extending between the substrate and the external interface. More particularly, the at least one electro-fluidic interconnect may include an interconnect body having at least one interconnect fluid passageway extending therethrough and connected to the at least one substrate fluid passageway, and at least one interconnect electrical conductor carried by the interconnect body. The at least one interconnect electrical conductor may connect the at least one substrate electrical conductor and the at least one interface electrical connector.

6987033, Jan 17, 2006

Aug 19, 2004

10/921511

Randy T. Pike - Indian Harbour Beach FL, US
Charles M. Newton - South East Palm Bay FL, US
Carol Gamlen - Melbourne FL, US
Raymond C. Rumpf - Melbourne FL, US
Betty O'Dowd - Melbourne FL, US

Harris Corporation - Melbourne FL

H01L 21/44
H01L 21/48
H01L 21/50

438122

A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

7035591, Apr 25, 2006

Apr 19, 2004

10/827004

Charles M. Newton - Palm Bay FL, US
Raymond C. Rumpf - Melbourne FL, US
Carol Gamlen - Melbourne FL, US

Harris Corporation - Melbourne FL

H04B 3/38

455 661, 455 74, 455344, 29825, 335 1, 335 78

A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

7285000, Oct 23, 2007

Aug 12, 2005

11/202530

Michael Pleskach - Orlando FL, US
Paul Koeneman - Palm Bay FL, US
Carol Gamlen - Melbourne FL, US
Steven R. Snyder - Palm Bay FL, US

Harris Corporation - Melbourne FL

H01R 4/60

439190

An electro-fluidic interconnection. The interconnection includes a body () formed of a ceramic material. The body () is provided with an aperture () having a profile suitable for receiving an interconnecting conduit (). The interconnecting conduit () can be formed of the same type of ceramic material as the body (). The conduit () is defined by an outer shell () with a hollow bore () for transporting a fluid. A mating portion () of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion () of the conduit () can be compression fitted within the aperture (). Conductive traces () on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

7522702, Apr 21, 2009

Aug 29, 2006

11/511671

John Richard DeSalvo - Satellite Beach FL, US
Charles M. Newton - Palm Bay FL, US
Carol Ann Gamlen - Melbourne FL, US
William Thomas Silfvast - Saint Helena CA, US
Gregory Michael Shimkaveg - Oviedo FL, US

Harris Corporation - Melbourne FL

G21K 5/00

378 64, 378122

A method is provided for decontaminating biological pathogens in a contaminated environment. The method includes: tailoring x-ray radiation to match the absorption characteristics of a contaminated environment; generating x-ray radiation having a diffused radiation angle in accordance with the absorption characteristics of the contaminated environment; and directing the x-ray radiation towards the contaminated environment.

7607223, Oct 27, 2009

Aug 7, 2007

11/834797

Mihael Pleskach - Orlando FL, US
Paul Koeneman - Palm Bay FL, US
Carol Gamlen - Melbourne FL, US
Steven R. Snyder - Palm Bay FL, US

Harris Corporation - Melbourne FL

H05K 3/02

29846, 29831, 29832, 29837, 29842, 29876, 439190, 439289

An electro-fluidic interconnection. The interconnection includes a body () formed of a ceramic material. The body () is provided with an aperture () having a profile suitable for receiving an interconnecting conduit (). The interconnecting conduit () can be formed of the same type of ceramic material as the body (). The conduit () is defined by an outer shell () with a hollow bore () for transporting a fluid. A mating portion () of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion () of the conduit () can be compression fitted within the aperture (). Conductive traces () on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.