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Carl Vincent Fong

from Carmichael, CA
Age ~63
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Also known as:
Carl V Fong
Phone and address:
3912 Nicklaus Pl, Carmichael, CA 95608
(916) 944-2418
Related to:
Marki T Fong, 29Stanley G Fukui, 56Morgan J Fong, 84Gwynne M Fong, 62Michaelle Lynn Ridge, 55Ray T Fukui, 91Barbara D Fukui, 59Jordan G Fukui, 28Jeanette J Fong, 85Jane S Fukui, 86Karen T Fukui, 63Vicky J Fong, 82
Connected to:
Agnes W Fong, 66Alcuin D Fong, 70Anne C Fong, 94Bethany J Fong, 42Carleton P Fong, 62Carline Fong, 80Carol Fong, 73Cha S Fong, 51Chen P Fong, 78Ching Fong, 59

Carl Fong Phones & Addresses

  • 3912 Nicklaus Pl, Carmichael, CA 95608 (916) 944-2418
  • 14 Yerba Ct, Sacramento, CA 95833
  • San Mateo, CA

Industries

Financial Services

Resumes

Resumes

Carl Fong Photo 1

Senior Financial Advisor At Valic

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Location:
Sacramento, California Area
Industry:
Financial Services

Business Records

Name / Title
Company / Classification
Phones & Addresses
Carl Fong
Pastor, Religious Leader
Living Water Christian Church
Religious Organization
1501 S El Camino Real, San Mateo, CA 94402
(650) 577-1110

Publications

Us Patents

Computerized Method And Apparatus For Designing Wire Bond Diagrams And Locating Bond Pads For A Semiconductor Device

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US Patent:
6357036, Mar 12, 2002
Filed:
Apr 29, 1999
Appl. No.:
09/301691
Inventors:
Laiman Eka - Milpitas CA
Carl H. Fong - Cupertino CA
Assignee:
Cirrus Logic, Inc. - Austin TX
International Classification:
G06F 1750
US Classification:
716 15
Abstract:
The present invention provides a bond tool utility software package which extracts bond pad location data from a semiconductor chip design stored in one of a number of known formats (e. g. , Opus, GDSII, or the like) and extracts conductor location data from an AUTOCAD file of a chip frame design. The utility retrieves bonding connection data from a design ASCII file and generates a bonding diagram for the semiconductor assembly. The utility also contains a subroutine for applying bonding design criteria to the resultant bonding diagram to determine whether all bonds are within established guidelines. If an impermissible bond is formed, the user may be alerted that one or more bonding pads may have to be relocated. In one embodiment of the present invention, the bonding utility may interface with a semiconductor design circuit to generate a suggested fix to an impermissible bonding situation. One or more bonding pads may be moved in the semiconductor design to correct for potential bonding deficiencies.

Integrated Manufacturing Solutions

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US Patent:
62565494, Jul 3, 2001
Filed:
May 13, 1998
Appl. No.:
9/078017
Inventors:
Bernadette P. Romero - Santa Clara CA
Carl H. Fong - Cupertino CA
Assignee:
Cirrus Logic, Inc. - Austin TX
International Classification:
G06F 1900
US Classification:
700121
Abstract:
The present invention provides a computerized database comprising a first table representing a list of part numbers. The database provides computerized links between individual part numbers and associated manufacturing process data for different process steps for that part number. Rather than correlate data by hand, a user may click on a process step for a particular part number to instantly and accurately retrieve that data. Manufacturing process data may include, for example, backgrind process data, wire binding data, either in numerical or graphical form, testing parameters, packaging data, and labeling data. The database system of the present invention may be used to automatically program various process equipment in an assembly facility with appropriate process data to automatically process finished semiconductor wafers into packaged semiconductor circuits.

System For Detecting And Correcting Misalignment Of Semiconductor Package Leads

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US Patent:
50618954, Oct 29, 1991
Filed:
Jan 19, 1990
Appl. No.:
7/467714
Inventors:
Carl H. Fong - San Jose CA
Assignee:
VLSI Technology, Inc. - San Jose CA
International Classification:
G01R 3100
US Classification:
324158R
Abstract:
A system for detecting whether the ends of leads of a semiconductor package are less than a small predetermined distance from a predetermined plane. The system uses a structure having a planar surface and an elevated portion on the surface where the portion is provided with a number of slots equal to or greater in number than the number of leads on one side of the package. The height of the slots above the surface is substantially equal to the predetermined distance. In order to test whether the end portions of the leads deviate from coplanarity by a distance greater than the predetermined distance, the package is placed with its leads in contact with the surface with the leads facing the slots. The package is then slid towards the slots to determine whether all of the leads will slide into the corresponding slots. The lateral distance between each pair of adjacent slots matches the distance between the corresponding pair of leads.

Multi-Purpose Bond Pad Test Die

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US Patent:
51535076, Oct 6, 1992
Filed:
Nov 16, 1990
Appl. No.:
7/614404
Inventors:
Carl H. Fong - San Jose CA
William K. Shu - Sunnyvale CA
Assignee:
VLSI Technology, Inc. - San Jose CA
International Classification:
G01R 3100
G01R 3102
US Classification:
324158R
Abstract:
A novel test die is disclosed for use in conjunction with a semiconductor assembly machine or process. The test die includes a plurality of sets of bond pads having different bond pad pitches which permits testing of those pitches with use of a single die. Bond pads suitable for array bonding and having different bond pad pitches are also disclosed. Electrical connections are provided between bond pads and permit detection of open and short circuits or other circuit defects. A staggered arrangement of bond pads permits bond pads to be packed more densely on the die. A method for fabricating a wafer having a plurality of bond pads which form a repeating pattern is given. The patterned wafer may be cut to form a test die having bond pads which are positioned to provide bond pad pitches as required by a user.

Amazon

Near-Rings And Near-Fields - Proceedings Of The Conference On Near-Rings And Near-Fields, Stellenbosch, South Africa, July 9--16, 1997

Near-Rings and Near-Fields - Proceedings of the Conference on Near-Rings and Near-Fields, Stellenbosch, South Africa, July 9--16, 1997

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Proceedings of the Conference on Near-Rings and Near-Fields, Stellenbosch, South Africa, July 9-16, 1997
Binding

Hardcover

Pages

212

Publisher

Springer

ISBN #

0792367065

EAN Code

9780792367062

ISBN #

6

Near-Rings And Near-Fields: Proceedings Of The Conference On Near-Rings And Near-Fields, Stellenbosch, South Africa, July 9-16, 1997

Near-Rings and Near-Fields: Proceedings of the Conference on Near-Rings and Near-Fields, Stellenbosch, South Africa, July 9-16, 1997

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Proceedings of the Conference on Near-Rings and Near-Fields, Stellenbosch, South Africa, July 9-16, 1997
Binding

Paperback

Pages

201

Publisher

Springer

ISBN #

9401038023

EAN Code

9789401038027

ISBN #

5

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Carl Vincent Fong from Carmichael, CA, age ~63 Get Report