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Bruce L Drolen

from Altadena, CA
Age ~69

Bruce Drolen Phones & Addresses

  • 1234 Calaveras St, Altadena, CA 91001 (626) 791-3050
  • Avila Beach, CA
  • Pasadena, CA
  • Albany, CA
  • El Segundo, CA
  • 1234 E Calaveras St, Altadena, CA 91001 (626) 827-5320

Work

Position: Professional/Technical

Skills

Microsoft Word • Microsoft Excel

Emails

Resumes

Resumes

Bruce Drolen Photo 1

Bruce Drolen

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Skills:
Microsoft Word
Microsoft Excel

Publications

Us Patents

Multi Operational System Apparatus And Method

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US Patent:
7583506, Sep 1, 2009
Filed:
Oct 14, 2005
Appl. No.:
11/250817
Inventors:
James P. Huang - Huntington Beach CA, US
Russell M. Abbott - Riverside CA, US
David J. Nakamura - La Palma CA, US
Leslie A. Momoda - Los Angeles CA, US
Kevin J. Rooney - West Hills CA, US
Bruce L. Drolen - Altadena CA, US
John H. Belk - St. Louis MO, US
Brian R. Foy - Cypress CA, US
Assignee:
The Boeing Company - Chiacgo IL
International Classification:
H05K 7/20
US Classification:
361719, 174252, 361700, 361704
Abstract:
An apparatus may have a multilayered support base having a structural section made up of operating components and a function support section. The function support section may have transmission paths and components to supply thermal, power transmission, information and communication paths, along with other functions. At least some of the components may be heat generating and may have a thermal interface surface which may be in operating and heat conductive relationship with a heat conductive substrate/routing section which may have operative connections to the multilayered support base. Some of the components may transmit and receive with one another through the substrate/routing section.

Cooling System And Associated Method For Planar Pulsating Heat Pipe

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US Patent:
20080087406, Apr 17, 2008
Filed:
Oct 13, 2006
Appl. No.:
11/549378
Inventors:
Julie F. Asfia - Huntington Beach CA, US
Marianne E. Mata - Dana Point CA, US
Chung-Lung Chen - Thousand Oaks CA, US
Qingjun Cai - Thousand Oaks CA, US
Bruce L. Drolen - Altadena CA, US
International Classification:
F28D 15/00
H05K 7/20
US Classification:
16510429, 16510433, 361700
Abstract:
A cooling assembly, system, and method are provided. The cooling assembly includes a plate comprising a plurality of channels defined in a surface of the plate and at least one pulsating heat pipe comprising tubing. At least a portion of the tubing is positioned within the channels, and the tubing is configured for carrying coolant therein.

Thermal Management Device And Method For Making The Same

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US Patent:
20090296345, Dec 3, 2009
Filed:
May 31, 2008
Appl. No.:
12/131081
Inventors:
Sean Nguyen - Fullerton CA, US
Gary L. Duncan - Torrance CA, US
Bruce L. Drolen - Altadena CA, US
David M. Bowden - Manchester MO, US
International Classification:
H05K 7/20
B23K 20/10
US Classification:
361689, 2281101
Abstract:
A thermal management device suitable for use as an electronic chassis includes a monolithic, monocoque body having integrally formed channels for carrying thermal energy away from a heat source, such as electronic components. The device may be fabricated using additive/subtractive manufacturing processes such as ultrasonic consolidation.

Adjustable Heat Rejection System

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US Patent:
57327653, Mar 31, 1998
Filed:
Dec 22, 1995
Appl. No.:
8/577439
Inventors:
Bruce L. Drolen - Pasadena CA
David B. Esposto - Redondo Beach CA
Ariel Gatti - San Gabriel CA
Calvin H. Ito - West Hills CA
Assignee:
Hughes Electronics
International Classification:
B64G 150
US Classification:
165 41
Abstract:
A spacecraft having a spacecraft body and a heat radiator attached to the spacecraft body. The heat radiator is in thermal contact with the spacecraft body and the heat radiator moves from an initial position to a deployed position where heat is emitted therefrom. The predetermined deployed position is located at an angular position. theta. as measured relative to the initial position, wherein. theta. ranges from approximately 135. degree. to less than 180. degree.

Heat Transport System For Spacecraft Integration

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US Patent:
57354898, Apr 7, 1998
Filed:
Dec 22, 1995
Appl. No.:
8/577434
Inventors:
Bruce L. Drolen - Pasadena CA
David B. Esposto - Redondo Beach CA
George L. Fleischman - Cerritos CA
Calvin H. Ito - West Hills CA
Assignee:
Hughes Electronics - Los Angeles CA
International Classification:
B64G 150
US Classification:
244163
Abstract:
The present invention relates to an apparatus for transferring heat in a spacecraft. The apparatus includes a flexible heat pipe having a first section, a second section, and a flexible section. A first member of a spacecraft is coupled to the first section of the flexible heat pipe, and a second member of the spacecraft is coupled to the second section of the flexible heat pipe. The first member of the spacecraft is in a rigidly fixed relationship to the second member of the spacecraft. A method of using a heat transport system for transferring heat in a spacecraft is also provided. The method includes providing a flexible heat pipe having a first section, a second section, and a flexible section, coupling the first section of the flexible heat pipe to a first member of a spacecraft, and coupling the second section of the flexible heat pipe to a second member of the spacecraft rigidly fixed with respect to the first member.

Flexible Heat Transport Design For Development Applications

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US Patent:
57879699, Aug 4, 1998
Filed:
Dec 22, 1995
Appl. No.:
8/577435
Inventors:
Bruce L. Drolen - Pasadena CA
David B. Esposto - Redondo Beach CA
George L. Fleischman - Cerritos CA
Calvin H. Ito - West Hills CA
Assignee:
Hughes Electronics Corporation - El Segundo CA
International Classification:
F28D 1502
B64G 150
F28F 500
US Classification:
165 41
Abstract:
A closed-loop heat pipe transport design for a deployment application having a flexible section which connects to a payload structure and a deployable structure. The flexible section is a coil which is offset from the axis of rotation of the deployable structure. Upon rotation of the deployable structure around a predetermined axis, the flexible coil decompresses and sweeps in an arcuate fashion with a portion of said flexible coil aligning with the axis. When the deployable structure has completed its rotation and is fully deployed, the flexible coil will rest in substantially the same plane as it did before sweeping.

Systems And Methods For Heat Balance And Transport For Aircraft Hydraulic Systems

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US Patent:
20170191509, Jul 6, 2017
Filed:
Mar 21, 2017
Appl. No.:
15/465139
Inventors:
- Seal Beach CA, US
Ty Aaby Larsen - Everett WA, US
Bruce L. Drolen - Altadena CA, US
International Classification:
F15B 21/04
F15B 18/00
F28D 15/06
F28D 7/10
F28D 15/04
F28D 15/02
Abstract:
A thermal management system includes a first hydraulic system for circulating a first hydraulic fluid at a first temperature and a second hydraulic system for circulating a second hydraulic fluid at a second temperature that is higher than the first temperature. The thermal management system also includes a sealed heat transfer device coupled between the first hydraulic system and the second hydraulic system. The sealed heat transfer device is not in flow communication with either of the first hydraulic system and the second hydraulic system. The sealed heat transfer device is configured to transfer heat from the second hydraulic fluid to the first hydraulic fluid.

Air Cooled Laser Systems Using Oscillating Heat Pipes

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US Patent:
20160141825, May 19, 2016
Filed:
Nov 19, 2014
Appl. No.:
14/547464
Inventors:
- Chicago IL, US
Bruce L. Drolen - Altadena CA, US
Steven E. Fisher - Tijeras NM, US
Juan M. Ceniceros - Placitas NM, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
H01S 3/04
H01S 3/042
H01S 3/0941
H01S 5/024
H01S 3/16
Abstract:
Provided are air cooled laser systems, such as portable air cooled laser systems, and methods of operating thereof. An air cooled laser system includes an oscillating heat pipe having one end thermally coupled to one or more laser diodes and the other end being air cooled. The oscillating heat pipe has an extremely high thermal conductivity (e.g., much higher than that of copper) which allows using ambient air for cooling. This air cooling aspect reduces the size, weight, and complexity of the system. Furthermore, the air cooling aspect reduces power consumption since no power is used for liquid circulation. To enhance air-cooling characteristics, the end of the oscillating heat pipe away from the diodes may be thermally coupled to one or more heat dissipating fins. Furthermore, the system may be equipped with a blower for controlling the flow of air around that end.
Bruce L Drolen from Altadena, CA, age ~69 Get Report