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Brigitte U Kiba

from Wylie, TX
Age ~75
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Also known as:
Brigitte Ursula Kiba, Brigille U Kiba, Brigitte Ursula Mosallimy, Brigette U Kiba, Brigitte U Kaba
Phone and address:
602 Pickwick Ln, St Paul, TX 75098
(214) 718-2585
Related to:
Alexander S MosallimyAshley Slovak, 29Jasmine B Slovak, 53Ashley Slovak, 61Paul K Slovak, 59
Connected to:
Hiroaki Kiba, 58Alice F Kiback, 56Jannipher N Kibanda, 74Stella W Kibara, 49Yelena Kibasova, 39Mugo P Kibati, 55Alan D Kibbe, 67Albert L Kibbe, 80Chad E Kibbe, 52Heather W Kibbe, 55

Brigitte Kiba Phones & Addresses

  • 602 Pickwick Ln, Wylie, TX 75098 (214) 718-2585
  • 1000 14Th St, Plano, TX 75074
  • 2854 Ursa Cir, Garland, TX 75044
  • Bronx, NY
  • Colton, TX

Resumes

Resumes

Brigitte Kiba Photo 1

Associate Mechanical Engineer

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Location:
Wylie, TX
Industry:
Defense & Space
Work:
Bk Associates Apr 1981 - Nov 2000
President
Cobham Mission Systems Apr 1981 - Nov 2000
Associate Mechanical Engineer
Brigitte Kiba Photo 2

Engineer, Electrical

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Location:
Dallas, TX
Industry:
Semiconductors
Work:
Cobham Dss
Engineer, Electrical

Business Records

Name / Title
Company / Classification
Phones & Addresses
Brigitte Kiba
Principal
Bk Associates
Nonclassifiable Establishments
602 Pickwick Ln, St Paul, TX 75098

Publications

Us Patents

Package For A High Frequency Semiconductor Device And Methods For Fabricating And Connecting The Same To An External Circuit

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US Patent:
55961711, Jan 21, 1997
Filed:
Jun 7, 1994
Appl. No.:
8/254977
Inventors:
James M. Harris - Terrell TX
Brigitte U. Kiba - Plano TX
Porter B. Click - Garland TX
International Classification:
H01L 2302
US Classification:
174 524
Abstract:
A package for a semiconductor die, particularly field effect transistors, operating at very high frequencies includes a base having integrally formed conductor supports. The base and the supports are formed from a thermo-formed or thermo-set plastic material. Metal conductors are plated to the supports and terminate in pads for connecting the die to an external circuit. A die is attached to the base and wires bonded to the package conductor pads. The surface of the die, the bond wires and the surface of the package conductors are substantially coplanar to reduce abrupt changes in the path of signal flow which reduces radiation losses. Package dimensions and conductor proximities and bond wire lengths are precisely located and enhanced to reduce parasitic inductances. When connected to an external circuit, the package is flipped and its lid inserted into a hole in the circuit board. The package conductors rest against the circuit board to the semiconductor device.

Process For Forming A Semiconductor Device Base Array And Mounting Semiconductor Devices Thereon

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US Patent:
56656491, Sep 9, 1997
Filed:
Feb 5, 1996
Appl. No.:
8/596589
Inventors:
James Marvin Harris - Terrell TX
Brigitte Ursula Kiba - Plano TX
Porter B. Click - Garland TX
Assignee:
Gardiner Communications Corporation - Garland TX
International Classification:
H01L 2148
H01L 2158
H01L 2160
H01L 2170
US Classification:
438110
Abstract:
A method of manufacturing semiconductor devices is disclosed which incorporates an array of bases formed on a plastic sheet. Each base in the array includes individual leads used to connect the semiconductor die to an external circuit. To keep the plastic sheet from flexing during assembly the plastic sheet is placed between a foundation and an anchor grid, where the foundation provides a rigid platform for the plastic sheet and the anchor grid hold the sheet to the foundation. Once the semiconductor dies have been attached to the bases, a protective cap is placed over the die. An adhesive sheet is then place over all the caps in the array allowing the array to be milled to separate the individual packages without scattering the devices.
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Brigitte U Kiba from Wylie, TX, age ~75 Get Report