US Patent:
20210114941, Apr 22, 2021
Inventors:
- Farmington CT, US
Brendan M. Lenz - Wethersfield CT, US
International Classification:
C04B 35/83
C04B 35/80
C04B 35/82
C04B 35/628
Abstract:
A void filler material includes a ceramic rod and a fibrous overwrap. The void filler material may be used in a ceramic matrix composite. The method of making the ceramic matrix composite includes inserting the void filler material in voids of a preform and depositing a ceramic matrix on the preform and the void filler material using chemical vapor infiltration.