Inventors:
Yongfa Fan - San Jose CA, US
Qiaolin Zhang - Mountain View CA, US
Bradley John Falch - Round Rock TX, US
Assignee:
Synopsys, Inc. - Mountain View CA
International Classification:
G06F 17/50
Abstract:
A method is described herein for predicting lateral position information about a feature represented in an integrated circuit layout for use with an integrated circuit fabrication process, where the process projects an image onto a resist. The method includes providing a lateral distribution of intensity values of the image at different depths with the resist. Next, the lateral position of an edge point of the feature is predicted in dependence upon a particular resist development time, and further in dependence upon the image intensity values at more than one depth within the resist.