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Brad Grande Phones & Addresses

  • 158 Cherry Tree Bend Rd, Port Murray, NJ 07865 (908) 835-1698
  • Marlboro, NJ
  • Saint Charles, IL
  • Warren, NJ
  • 158 Cherry Tree Bend Rd, Port Murray, NJ 07865

Work

Company: Lsi corp 2007 to 2012 Address: Allentown, Pennsylvania Area Position: Technical manager systems hardware design

Education

Degree: Master of Science (MS) School / High School: Illinois Institute of Technology Specialities: EE

Skills

Ic • Pcie • Mixed Signal • Circuit Design and Manufacturing • Rapid Prototyping • Regulatory Approvals • Cadence Allegro • 10/100Base T/1000Base X • V92 • 802.11 • G.992L • Usb • Power Supplies • Thermal • Toc • Program Management • Circuit Design • Ddr3 • Cadence • Telecommunications • Debugging • Ddr2 • Hardware Architecture • Embedded Systems • Asic • Analog • Pcb Design • Soc • Fpga • Digital Signal Processors • Analog Circuit Design • Semiconductors • Cmos • Firmware • Rf • Hardware

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Brad Grande Photo 1

Development Operations Project Manager And Agile Scrum Master At Nokia

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Location:
158 Cherry Tree Bend Rd, Port Murray, NJ 07865
Industry:
Electrical/Electronic Manufacturing
Work:
LSI Corp - Allentown, Pennsylvania Area 2007 - 2012
Technical Manager Systems Hardware Design

Agere Systems, Inc. 2002 - 2007
Technical Manager

Lucent Technologies 1995 - 2002
Technical Manager
Education:
Illinois Institute of Technology
Master of Science (MS), EE
University of Colorado at Boulder
Bachelor of Science (BS), EE/CS
Skills:
Ic
Pcie
Mixed Signal
Circuit Design and Manufacturing
Rapid Prototyping
Regulatory Approvals
Cadence Allegro
10/100Base T/1000Base X
V92
802.11
G.992L
Usb
Power Supplies
Thermal
Toc
Program Management
Circuit Design
Ddr3
Cadence
Telecommunications
Debugging
Ddr2
Hardware Architecture
Embedded Systems
Asic
Analog
Pcb Design
Soc
Fpga
Digital Signal Processors
Analog Circuit Design
Semiconductors
Cmos
Firmware
Rf
Hardware

Publications

Us Patents

Single-Transformer Digital Isolation Barrier

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US Patent:
7773733, Aug 10, 2010
Filed:
Jun 23, 2005
Appl. No.:
11/159614
Inventors:
Boris A. Bark - Middletown NJ, US
Brad L. Grande - Port Murray NJ, US
Peter Kiss - Basking Ridge NJ, US
Johannes G. Ransijn - Wyomissing Hills PA, US
James D. Yoder - Leola PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H04M 11/00
US Classification:
379 9306
Abstract:
The invention provides a single digital communication link between system-side and line-side circuitry in a DAA, capable both of carrying data signals and of transferring a substantial amount of power to the line-side circuitry. The invention comprises a system-side interface circuit, a line-side interface circuit, and an isolation barrier including a transformer. Each interface circuit is capable of connection to an upstream communication circuit (either line-side or system-side), from which it may receive data signals to be transmitted across the isolation barrier to the other interface circuit, and to which it may pass data signals received across the isolation barrier from the other interface circuit. The line-side interface circuit may further include a rectifier and a storage device.

Telephone Line Power Supply

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US Patent:
20020076038, Jun 20, 2002
Filed:
Nov 6, 2001
Appl. No.:
09/992625
Inventors:
Michael Barrese - Middletown NJ, US
Brad Grande - Marlboro NJ, US
Vernon Koll - Hazlet NJ, US
Eugene Yurek - Hazlet NJ, US
International Classification:
H04M001/00
H04M009/00
US Classification:
379/413000, 379/399010
Abstract:
A telephone line driven power supply and power supply method capable of creating high yield, low voltage power using power drawn from a telephone line and supplementing the low voltage power with power from a battery-powered host device, such as a laptop PC, when the voltage level falls below a predetermined voltage level. The telephone line power supply includes a polarity guard, a gyrator, an oscillator, a pulse circuit, an inductor, a startup circuit, a converter, a shunt regulator, and a combiner circuit. The method includes supplying line power from power drawn from a telephone line, receiving host power from a host device, supplying the line power to an electrical device, and supplementing the line power with the host power when the voltage level of the line power falls below a predetermined level.

Method And Apparatus For Mounting A Modem To A Carrier Assembly

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US Patent:
20050190824, Sep 1, 2005
Filed:
Feb 26, 2004
Appl. No.:
10/787380
Inventors:
Brad Grande - Marlboro NJ, US
Rodney Mehrlander - Oceanport NJ, US
International Classification:
H04B001/38
US Classification:
375222000
Abstract:
A method and apparatus are disclosed for connecting a modem to a motherboard in a computing device, such as a personal computer. The disclosed modem module comprises circuitry for interfacing with a telephone line; and one or more solder pads for connecting the modem module to a carrier assembly, such as a motherboard. The solder pads on the modem module may be soldered to corresponding solder pads on the carrier assembly. The modem module optionally includes a tip/ring connector for interfacing with a telephone line. A disclosed method for fabricating a discrete modem upon a printed circuit board (PCB) or other stand-alone mounting comprises the steps of providing circuitry on a printed circuit board for interfacing with a telephone line; and providing one or more solder pads on the printed circuit board for connecting the modem module to a carrier assembly.

Signal-Powered Integrated Circuit With Esd Protection

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US Patent:
20100246695, Sep 30, 2010
Filed:
Jun 7, 2010
Appl. No.:
12/794845
Inventors:
Boris A. Bark - Middletown NJ, US
Brad L. Grande - Port Murray NJ, US
Peter Kiss - Basking Ridge NJ, US
Johannes G. Ransijn - Wyomissing Hills PA, US
James D. Yoder - Leola PA, US
Assignee:
AGERE SYSTEMS INC. - Allentown PA
International Classification:
H04B 3/00
US Classification:
375257
Abstract:
The invention provides a signal-powered integrated circuit (IC). The IC comprises an integrated circuit die including a ground node, a supply node, and a first terminal for receiving a digital data signal having data content and a predetermined energy. A receive buffer formed on the integrated circuit die is connected to the first terminal and capable of receiving the data content associated with the digital data signal. A rectifier is also formed on the integrated circuit die. The rectifier includes a first diode connected between the first terminal and the ground node and a second diode connected between the first terminal and the supply node. The rectifier is configured to rectify the digital data signal and pass at least a portion of the digital data signal's predetermined energy to the supply node. Each of the first and second diodes is capable of withstanding an ESD impulse.
Brad L Grande from Port Murray, NJ, age ~65 Get Report