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Boonsri Wangmaneerat Phones & Addresses

  • Beaverton, OR
  • 5004 Chicago St, Chandler, AZ 85226 (480) 705-4946
  • Albuquerque, NM
  • Portland, OR
  • 5004 W Chicago Cir N, Chandler, AZ 85226 (480) 861-0437

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Stacked Integrated Circuit Packages And Methods Of Making The Packages

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US Patent:
20050121769, Jun 9, 2005
Filed:
Dec 5, 2003
Appl. No.:
10/729544
Inventors:
Nicholas Watts - Phoenix AZ, US
Eric Palmer - Tempe AZ, US
Jui Lim - Chandler AZ, US
Todd Myers - Gilbert AZ, US
Boonsri Wangmaneerat - Chandler AZ, US
International Classification:
H01L023/04
H01L021/44
US Classification:
257698000, 257686000, 438109000, 257688000, 438117000
Abstract:
In some embodiments, a method includes providing a substrate, providing a coverlay blank, laminating the coverlay blank to the substrate, and forming at least one opening in the coverlay blank by photolithography.
Boonsri Wangmaneerat from Beaverton, OR, age ~66 Get Report