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Bhavyen S Sanghavi

from Portland, OR
Age ~70
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Also known as:
Bhavyem S Sanghavi, Bhavyen S Sanghari, Pooja Sanghavi, Sanghavi Bhavyen, N Sanghavi, Chetna Sanghavi, Nupur Sanghavi
Phone and address:
15892 NW Trakehner Way, Portland, OR 97229
(503) 617-6640
Related to:
Neetal Mistry, 44Pooja Sanghavi, 35Chetna B Sanghavi, 67Nupur B Sanghavi, 34
Connected to:
Ankit A Sanghavi, 36Dakshesh M Sanghavi, 62Devendra P Sanghavi, 43Dipali Sanghavi, 42Ekta H Sanghavi, 45Harshal S Sanghavi, 49Ila Sanghavi, 72Jairaj M Sanghavi, 58Kalpesh A Sanghavi, 52Pragna Sanghavi, 76

Bhavyen Sanghavi Phones & Addresses

  • 15892 NW Trakehner Way, Portland, OR 97229 (503) 617-6640
  • 4471 Chanticleer Dr, Portland, OR 97229 (503) 617-6640
  • Bellevue, WA
  • Columbus, OH
  • Austin, TX
  • San Jose, CA
  • Milpitas, CA
  • Redmond, WA
  • 15892 NW Trakehner Way, Portland, OR 97229

Work

Company: Honeywell Aug 2012 Address: Redmond Wa Position: Advanced manufacturing engineer

Education

Degree: M.S. School / High School: Texas A&M University 1981 to 1982 Specialities: Chemical Engineer

Skills

Manufacturing • Design For Manufacturing • Lean Manufacturing • Six Sigma • Spc • Design of Experiments • Process Simulation • Electronics • Engineering • Fmea • Process Engineering • Product Development • Rohs • Failure Analysis • R&D • Manufacturing Engineering • Manufacturing Operations • Continuous Improvement • Manufacturing Operations Management • 5S • Process Improvement • Quality System • Quality Assurance • Iso • Root Cause Analysis • Chemical Engineering • Materials • Engineering Management • Dmaic • Semiconductors • Kaizen • Value Stream Mapping • Quality Management • Cross Functional Team Leadership • Product Engineering • Operational Excellence • Mrp • Statistical Process Control • Failure Mode and Effects Analysis • Iso Standards

Ranks

Certificate: Lean Six Sigma Green Belt (Icgb)

Emails

s***[email protected]

Industries

Semiconductors

Resumes

Resumes

Bhavyen Sanghavi Photo 1

Process Support Engineer

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Location:
Portland, OR
Industry:
Semiconductors
Work:
Honeywell - Redmond Wa since Aug 2012
Advanced Manufacturing Engineer
Viasystems Inc - San Jose, CA 2011 - Jul 2012
Senior Process Engineer
DDI Corp 2009 - 2011
Senior Process Engineer
TTM Technology 2004 - 2009
Senior Process engineer
TTM Technologies 2004 - 2009
Senior Engineer
Education:
Texas A&M University 1981 - 1982
M.S., Chemical Engineer University of Mumbai 1974 - 1978
B.S., Chemical Engineering
Skills:
Manufacturing
Design For Manufacturing
Lean Manufacturing
Six Sigma
Spc
Design of Experiments
Process Simulation
Electronics
Engineering
Fmea
Process Engineering
Product Development
Rohs
Failure Analysis
R&D
Manufacturing Engineering
Manufacturing Operations
Continuous Improvement
Manufacturing Operations Management
5S
Process Improvement
Quality System
Quality Assurance
Iso
Root Cause Analysis
Chemical Engineering
Materials
Engineering Management
Dmaic
Semiconductors
Kaizen
Value Stream Mapping
Quality Management
Cross Functional Team Leadership
Product Engineering
Operational Excellence
Mrp
Statistical Process Control
Failure Mode and Effects Analysis
Iso Standards
Certifications:
Lean Six Sigma Green Belt (Icgb)

Publications

Us Patents

Fine Pitch Solder Formation On Printed Circuit Board Process And Product

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US Patent:
54930758, Feb 20, 1996
Filed:
Sep 30, 1994
Appl. No.:
8/315746
Inventors:
Ku H. Chong - Austin TX
Charles H. Crockett - Austin TX
Julian P. Partridge - Austin TX
Bhavyen S. Sanghavi - Austin TX
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 118
US Classification:
174261
Abstract:
A method, and product created thereby, by which low melting point solder suitable for reflow connection of components is formed on select fine pitch contacts of a printed circuit board. The method is particularly suited to the attachment of flip-chip die to printed circuit boards which also include coarse pitch surface mount components. Controlled volumes of solder are formed onto fine pitch contacts of the printed circuit board through selective holes in a mask formed onto the board. The deposit is accomplished by molten solder immersion preferably using conventional hot air solder level manufacturing equipment. The volume of solder is related to the thickness of the mask. The mask is then removed, the deposited low temperature solder is flattened, and the coarse pitch contacts are covered with solder paste in a conventional screening process. Flux is applied to the fine pitch contacts. After component placement, the solder reflow connects in one operation both the fine and coarse pitch components to their respective printed circuit board contacts.

Fine Pitch Solder Formation On Printed Circuit Board Process And Product

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US Patent:
55359361, Jul 16, 1996
Filed:
May 30, 1995
Appl. No.:
8/453029
Inventors:
Ku H. Chong - Austin TX
Charles H. Crockett - Austin TX
Julian P. Partridge - Austin TX
Bhavyen S. Sanghavi - Austin TX
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2158
US Classification:
228175
Abstract:
A method, and product created thereby, by which low melting point solder suitable for reflow connection of components is formed on select fine pitch contacts of a printed circuit board. The method is particularly suited to the attachment of flip-chip die to printed circuit boards which also include coarse pitch surface mount components. Controlled volumes of solder are formed onto fine pitch contacts of the printed circuit board through selective holes in a mask formed onto the board. The deposit is accomplished by molten solder immersion preferably using conventional hot air solder level manufacturing equipment. The volume of solder is related to the thickness of the mask. The mask is then removed, the deposited low temperature solder is flattened, and the coarse pitch contacts are covered with solder paste in a conventional screening process. Flux is applied to the fine pitch contacts. After component placement, the solder reflow connects in one operation both the fine and coarse pitch components to their respective printed circuit board contacts.
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Bhavyen S Sanghavi from Portland, OR, age ~70 Get Report