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Avinoam Kornblit Phones & Addresses

  • 432 Denison St, Highland Park, NJ 08904 (732) 828-3814
  • New Brunswick, NJ

Business Records

Name / Title
Company / Classification
Phones & Addresses
Avinoam Kornblit
Avtek Solutions LLC
Computer Related Services
432 Denison St, New Brunswick, NJ 08904

Publications

Us Patents

Transistor Fabrication Method

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US Patent:
6498080, Dec 24, 2002
Filed:
Jan 16, 1996
Appl. No.:
08/587061
Inventors:
Sailesh Chittipeddi - Whitehall PA
Taeho Kook - Lower Macungie Township, Lehigh County PA
Avinoam Kornblit - Highland Park NJ
Assignee:
Agere Systems Guardian Corp. - Orlando FL
International Classification:
H01L 213205
US Classification:
438585, 438305, 438592
Abstract:
A method of forming low stack height transistors having controllable linewidth in an integrated circuit without channeling is disclosed. A disposable hardmask of doped glass is utilized to define the gate and subsequently protect the gate (and the underlying substrate) during ion implantation which forms the source and drains. A variety of silicided and non-silicided) structures may be formed.

Device Having A High Dielectric Constant Material And A Method Of Manufacture Thereof

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US Patent:
6511872, Jan 28, 2003
Filed:
Jul 10, 2001
Appl. No.:
09/902358
Inventors:
Avinoam Kornblit - Highland Park NJ
Kalman Pelhos - New Brunswick NJ
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L 21336
US Classification:
438197, 438722
Abstract:
The present invention provides a method of manufacturing a semiconductor device. The method includes depositing a metal oxide containing a dopant and having a high dielectric constant on a substrate; wherein the metal is aluminum or silicon and the dopant is zirconium or hafnium and etching the doped metal oxide with a plasma containing a halogenated compound.

Adjustable Compound Microlens Apparatus With Mems Controller

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US Patent:
6912090, Jun 28, 2005
Filed:
Mar 18, 2003
Appl. No.:
10/391330
Inventors:
Avinoam Kornblit - Highland Park NJ, US
Stanley Pau - Hoboken NJ, US
Maria Elina Simon - New Providence NJ, US
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
G02B027/10
US Classification:
359619, 359621, 359622
Abstract:
An adjustable compound optical microlens apparatus comprises first and second microlenses that are separated from one another along their optical axes. At least one of the microlenses is movable relative to the other. In a preferred embodiment, one microlens is stationary, the other movable. A MEMS controller electrically controls the position of the movable microlens relative to the stationary microlens, or the positions of at least two movable microlenses relative to one another. In accordance with one embodiment of our invention, an array of such microlens apparatuses is also contemplated, especially for applications such optical switches and routers. In accordance with another embodiment of our invention, the apparatus functions as an optical filter or dispersion compensator. Also described is method of compensating for variations in an optical parameter (e. g. , effective focal length) of such an apparatus in an array.

Method And Apparatus For Controlling Friction Between A Fluid And A Body

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US Patent:
7156032, Jan 2, 2007
Filed:
Aug 27, 2003
Appl. No.:
10/649285
Inventors:
Avinoam Kornblit - Highland Park NJ, US
Timofei Nikita Kroupenkine - Warren NJ, US
Mary Louise Mandich - Martinsville NJ, US
Tobias Manuel Schneider - Marburg, DE
Joseph Ashley Taylor - Springfield NJ, US
Donald Weiss - Cresskill NJ, US
Shu Yang - Philadelphia PA, US
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B63B 1/34
B64C 21/00
US Classification:
114 67R
Abstract:
A method and apparatus is disclosed wherein nanostructures or microstructures are disposed on a surface of a body (such as a submersible vehicle) that is adapted to move through a fluid, such as water. The nanostructures or microstructures are disposed on the surface in a way such that the contact between the surface and the fluid is reduced and, correspondingly, the friction between the surface and the fluid is reduced. In an illustrative embodiment, the surface is a surface on a submarine or other submersible vehicle (such as a torpedo). Illustratively, electrowetting principles are used to cause the fluid to at least partially penetrate the nanostructures or microstructures on the surface of the body in order to selectively create greater friction in a desired location of the surface. Such penetration may be used, for example, to create drag that alters the direction or speed of travel of the body.

Micro-Channel Chemical Concentrator

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US Patent:
7220388, May 22, 2007
Filed:
Feb 25, 2004
Appl. No.:
10/786199
Inventors:
David John Bishop - Summit NJ, US
John VanAtta Gates - New Providence NJ, US
Marc Scott Hodes - New Providence NJ, US
Avinoam Kornblit - Highland Park NJ, US
Stanley Pau - Hoboken NJ, US
Brijesh Vyas - Warren NJ, US
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B01L 3/02
B01L 11/00
B32B 5/02
B32B 27/04
B32B 27/12
G01N 1/22
G01N 1/18
G01N 1/10
B01D 63/00
US Classification:
422100, 422101, 436181, 436180, 436178, 2103216
Abstract:
Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In general, the fluid includes first and second chemical substances having different vapor pressures. The apparatus includes an evaporation controller for increasing the evaporation rate of the fluid from the channel into the ambient region, thereby increasing the concentration of the higher vapor pressure (HVP) substance in the portion of the fluid remaining in the channel and increasing the concentration of the lower vapor pressure (LVP) substance in the portion of the fluid evaporated into the ambient region.

Method And Apparatus For Controlling Friction Between A Fluid And A Body

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US Patent:
7455021, Nov 25, 2008
Filed:
Sep 11, 2006
Appl. No.:
11/518694
Inventors:
Avinoam Kornblit - Highland Park NJ, US
Timofei Nikita Kroupenkine - Warren NJ, US
Mary Louise Mandich - Martinsville NJ, US
Tobias Manuel Schneider - Marburg, DE
Joseph Ashley Taylor - Springfield NJ, US
Donald Weiss - Cresskill NJ, US
Shu Yang - Philadelphia PA, US
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B63B 1/34
B63B 21/00
US Classification:
114 67R
Abstract:
A method and apparatus is disclosed wherein nanostructures or microstructures are disposed on a surface of a body (such as a submersible vehicle) that is adapted to move through a fluid, such as water. The nanostructures or microstructures are disposed on the surface in a way such that the contact between the surface and the fluid is reduced and, correspondingly, the friction between the surface and the fluid is reduced. In an illustrative embodiment, the surface is a surface on a submarine or other submersible vehicle (such as a torpedo). Illustratively, electrowetting principles are used to cause the fluid to at least partially penetrate the nanostructures or microstructures on the surface of the body in order to selectively create greater friction in a desired location of the surface. Such penetration may be used, for example, to create drag that alters the direction or speed of travel of the body.

Microelectronic Element Chips

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US Patent:
7474005, Jan 6, 2009
Filed:
May 31, 2006
Appl. No.:
11/445072
Inventors:
Vladimir Anatolyevich Aksyuk - Westfield NJ, US
Nagesh R Basavanhally - Skillman NJ, US
Avinoam Kornblit - Highland Park NJ, US
Warren Yiu-Cho Lai - Chatham Township NJ, US
Joseph Ashley Taylor - Springfield NJ, US
Robert Francis Fullowan - Berkley Heights NJ, US
Assignee:
Alcatel-Lucent USA Inc. - Murray Hill NJ
International Classification:
H01L 23/52
H01L 23/48
H01L 29/40
US Classification:
257777, 257E27161, 257685, 257686, 257778, 437209, 437902, 438108
Abstract:
Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces. Process including: providing an apparatus including a chip substrate having a first chip surface facing away from a second chip surface, an array of microelectronic elements being on the first chip surface, an array of conductors each being in communication with one of the microelectronic elements and partially spanning an average distance between the first and second chip surfaces; bonding a temporary support carrier onto the array of microelectronic elements; removing a portion of the chip substrate, thereby reducing the average distance between the first and second chip surfaces; and forming an under bump metallization pad at the second chip surface in electrical communication with a conductor.

Thermal Energy Transfer Device

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US Patent:
7832462, Nov 16, 2010
Filed:
Mar 31, 2008
Appl. No.:
12/080408
Inventors:
Nagesh R. Basavanhally - Skillman NJ, US
Marc Scott Hodes - Dublin, IE
Paul Robert Kolodner - Hoboken NJ, US
Avinoam Kornblit - Highland Park NJ, US
Thomas Nikita Krupenkin - Middleton WI, US
Wonsuck Lee - Basking Ridge NJ, US
Alan Michael Lyons - New Providence NJ, US
Todd Richard Salamon - Chatham NJ, US
Brijesh Vyas - Warren NJ, US
Assignee:
Alcatel-Lucent USA Inc. - Murray Hill NJ
International Classification:
F28D 15/00
US Classification:
16510426, 16510433, 361700
Abstract:
Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane. Process includes providing wick evaporator, providing liquid working fluid in contact with lower or upper surface of membrane, and causing liquid working fluid to be evaporated from liquid-vapor interface in membrane.
Avinoam Kornblit from Highland Park, NJ, age ~81 Get Report