Inventors:
David Tuckerman - Lafayette CA, US
Giles Humpston - Aylesbury, GB
Michael Nystrom - San Jose CA, US
Charles Goudge - Palo Alto CA, US
Anita Woll - Santa Clara CA, US
Assignee:
Tessera, Inc. - San Jose CA
International Classification:
H01L 31/0203
H01L 21/50
H01L 23/02
US Classification:
257434000, 257680000, 438460000, 257E31110, 257E23180, 257E21499
Abstract:
Methods are provided for fabricating packaged chips having protective layers, e.g., lids or other overlying layers having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures and assemblies including lidded chips are also provided.