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Andrew R Motzko

from Hastings, MN
Age ~37
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Related to:
Jean M Goff, 77Philip J Goff, 55Chelsey Goff, 74Sarah Goff, 44Michael Goff, 59Zachary M Goff, 31
Connected to:
Jeanne M Motzko, 90Pam L Motzko, 67Ronald A Motzkus, 61Sonja T Motzkus, 63Michael D Motzny, 46Alex Z Mou, 60Anni Mou, 67Chi H Mou, 57Yi Mou, 36Youness Mou, 37

Andrew Motzko Phones & Addresses

  • 2060 Highland Dr, Hastings, MN 55033 (320) 237-5242
  • 3035 Eagandale Blvd, Eagan, MN 55121 (651) 330-3072
  • Saint Paul, MN
  • 509 10Th St, Benson, MN 56215 (320) 843-4114
  • Minneapolis, MN

Interests

career opportunities, consulting offers,...

Industries

Computer Hardware

Resumes

Resumes

Andrew Motzko Photo 1

Design Engineer At Seagate Technology

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Location:
Greater Minneapolis-St. Paul Area
Industry:
Computer Hardware
Experience:
Seagate Technology (Public Company; 10,001 or more employees; STX; Computer Hardware industry): Design Engineer,  (-) 

Publications

Wikipedia

Joe Motzko

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Joseph Andrew Motzko (born March 14, 1980 in Bemidji, Minnesota) is an American ice hockey forward currently with ERC Ingolstadt of the Deutsche Eishockey ...

Us Patents

Head Interconnect Circuit With Alignment Finger

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US Patent:
6399889, Jun 4, 2002
Filed:
Sep 13, 1999
Appl. No.:
09/394153
Inventors:
Kurt J. Korkowski - Hudson WI
Kenneth R. Fastner - Inver Grove Heights MN
Adam K. Himes - Richfield MN
Gregory P. Myers - Edina MN
Andrew R. Motzko - Burnsville MN
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
H05K 100
US Classification:
174255, 174261, 174254, 361741, 361743, 361772, 361776, 361803
Abstract:
A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.

Method For Connecting A Head Interconnect Circuit With Alignment Finger To A Printed Circuit

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US Patent:
6634086, Oct 21, 2003
Filed:
Apr 9, 2001
Appl. No.:
09/829213
Inventors:
Kurt J. Korkowski - Hudson WI
Kenneth R. Fastner - Inver Grove Heights MN
Adam K. Himes - Richfield MN
Gregory P. Myers - Edina MN
Andrew R. Motzko - Burnsville MN
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
G11B 5127
US Classification:
2960303, 2960304, 2960302, 174255, 3602642
Abstract:
A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.

Flex Cable Assembly With Improved Flex Cable Dynamic Loop Characteristics

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US Patent:
6856490, Feb 15, 2005
Filed:
Jun 25, 2002
Appl. No.:
10/180427
Inventors:
Wolfgang Rosner - Burnsville MN, US
Andrew R. Motzko - Savage MN, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
G11B005/55
G11B033/12
H05K007/02
US Classification:
3602642, 360 9701, 361685, 361749
Abstract:
A flex cable assembly for use in a disc drive data storage device includes a laminated flex cable and a flex cable support. The flex cable provides electrical communication paths between a moveable head stack assembly and a disc drive printed circuit board. The flex cable support comprises a base and adjacent first and second flex support portions with respective first and second flex support surfaces. The flex cable is routed along the flex support surfaces and exerts a spring force thereagainst as the flex cable attempts to return to a nominally planar orientation. The direction of the second flex support surface establishes the orientation of a dynamic loop between the flex cable support and the head stack assembly. Preferably, a portion of the flex cable pulls away from the second flex support surface to lengthen the dynamic loop in response to movement of the head stack assembly.

Method Of Making An Electrical Connection

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US Patent:
7137196, Nov 21, 2006
Filed:
Jul 2, 2004
Appl. No.:
10/884053
Inventors:
Neal F. Gunderson - Lake Elmo MN, US
Frank W. Bernett - Longmont CO, US
Andrew R. Motzko - Delano MN, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
H01R 43/00
US Classification:
29884, 29874, 29876
Abstract:
An interface to make interconnections between the interior and exterior of a sealed enclosure may include a flat connector (FC). The FC may comprise at least one layer of a substantially planar substrate. Each substrate layer may include metallization for conducting signals between contacts on an interior-facing surface and contacts on an exterior-facing surface. In an enclosure with an aperture for passing electrical conductors, the FC may be configured to seal the aperture to inhibit the escape of a low density gas, such as helium, for a long period of time. In one embodiment, the FC may include metallization configured to minimize helium leakage. As such, the FC may conduct electrical signals into and out of the sealed enclosure. Such signals may include, for example, power, control, and data signals for operating devices housed within the enclosure.

Flex On Suspension With A Heat-Conducting Protective Layer For Reflowing Solder Interconnects

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US Patent:
7646567, Jan 12, 2010
Filed:
Jun 28, 2005
Appl. No.:
11/168792
Inventors:
David Daniel Backlund - Prior Lake MN, US
Rick Pfahl Freeman - Northfield MN, US
Andrew Robert Motzko - Delano MN, US
Erik Jon Lindquist - Oakdale MN, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
G11B 5/55
H04R 31/00
US Classification:
3602642, 2960304
Abstract:
A FOS is provided for electrically connecting a data transfer head with a PCCA. The FOS comprises a polymeric layer supporting an electrical trace. The electrical trace comprises an uninsulated pad surface configured for electrically engaging a solder interconnect of the PCCA. The polymeric layer comprises a continuous portion covering the pad and opposing the pad surface. A method is provided comprising providing the FOS comprising the electrical trace and the polymeric covering, contactingly engaging the pad surface portion of the trace with the solder interconnect portion of the PCCA, and conducting heat through the polymeric covering to reflow the solder interconnect, thereby electrically connecting the FOS to the PCCA.

Head-Disc Interface (Hdi) Modal Response Monitoring

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US Patent:
7742255, Jun 22, 2010
Filed:
Jul 11, 2007
Appl. No.:
11/776206
Inventors:
Antanas Daugela - Savage MN, US
Subra Nagarajan - Prior Lake MN, US
Jason W. Riddering - Prior Lake MN, US
Neal F. Gunderson - Lake Elmo MN, US
John S. Wright - Minneapolis MN, US
Stefan A. Ionescu - Burnsville MN, US
Rick P. Freeman - Northfield MN, US
Erick J. Lindquist - Oakdale MN, US
Andrew R. Motzko - Delano MN, US
Zine Eddine Boutaghou - St. Paul MN, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
G11B 5/596
US Classification:
360 7812
Abstract:
Apparatus and method for head-disc interface (HDI) modal response monitoring. A sensing element disposed on a rigid actuator arm is mechanically impedance matched to a head-disc interface (HDI) supported by the actuator arm to resonate at a predetermined frequency corresponding to at least one disturbance associated with the HDI.

Microactuator Control That Avoids Thermal Asperities On Disk Surfaces

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US Patent:
7804661, Sep 28, 2010
Filed:
Dec 1, 2008
Appl. No.:
12/325563
Inventors:
Lawrence Allen Wilcox - Shakopee MN, US
Andrew Robert Motzko - Delano MN, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
G11B 21/02
G11B 5/596
US Classification:
360 75, 360 7707
Abstract:
While a microactuator is controlled to cause a head to follow a track on a disk surface, one or more other microactuators are separately controlled to offset other heads away from locations of thermal asperities on other associated disk surfaces.

Flex Circuit Assembly With Thermal Energy Dissipation

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US Patent:
7952834, May 31, 2011
Filed:
Feb 22, 2008
Appl. No.:
12/035707
Inventors:
Rick Pfahl Freeman - Northfield MN, US
Andrew R. Motzko - Delano MN, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
G11B 5/48
G11B 21/16
US Classification:
3602441, 360 9702, 3602459, 3602642
Abstract:
In accordance with various embodiments, a printed structure of a flex circuit assembly includes a plurality of adjacent land portions formed on a heat conductive stiffener member and which support electrically conductive paths for connection to an integrated circuit. A corresponding plurality of separation channels are formed between the adjacent electrically conductive paths, and thermal energy generated by operation of the integrated circuit is transferred through the separation channels to the stiffener member. In some embodiments, the separation channels retain a fluid, such as air or a low density inert gas, which flows through the separation channels in response to rotation of a rotatable member adjacent the flex circuit assembly. In other embodiments, a dielectric, thermally conductive material fills the separation channels.
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Andrew R Motzko from Hastings, MN, age ~37 Get Report