Andrew N Kao

7382142, Jun 3, 2008

May 18, 2005

11/133021

Fu Chiung Chong - Saratoga CA, US
Andrew Kao - Fremont CA, US
Douglas McKay - San Jose CA, US
Anna Litza - Cupertino CA, US
Douglas Modlin - Palo Alto CA, US
Sammy Mok - Cupertino CA, US
Nitin Parekh - Los Altos CA, US
Frank John Swiatowiec - San Jose CA, US
Zhaohui Shan - San Jose CA, US

NanoNexus, Inc. - San Jose CA

G01R 31/02

324754

An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

7872482, Jan 18, 2011

Sep 19, 2007

11/858064

Fu Chiung Chong - Saratoga CA, US
Andrew Kao - Fremont CA, US
Douglas McKay - San Jose CA, US
Anna Litza - Cupertino CA, US
Douglas Modlin - Palo Alto CA, US
Sammy Mok - Cupertino CA, US
Nitin Parekh - Los Altos CA, US
Frank John Swiatowiec - San Jose CA, US
Zhaohui Shan - Spring TX, US

Verigy (Singapore) Pte. Ltd - Singapore

G01R 31/02

324754

An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

7884634, Feb 8, 2011

Jan 15, 2009

12/354520

Fu Chiung Chong - Saratoga CA, US
Andrew Kao - Fremont CA, US
Douglas McKay - San Jose CA, US
Anna Litza - Cupertino CA, US
Douglas Modlin - Palo Alto CA, US
Sammy Mok - Cupertino CA, US
Nitin Parekh - Los Altos CA, US
Frank John Swiatowiec - San Jose CA, US
Zhaohui Shan - Spring TX, US

Verigy (Singapore) Pte, Ltd - Singapore

G01R 31/26

324765

An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

20100191572, Jul 29, 2010

Jan 26, 2009

12/360040

Patrick NEWMAN - Palo Alto CA, US
Andrew KAO - Sunnyvale CA, US
Aaron MUNTER - San Francisco CA, US

REARDEN COMMERCE, INC. - Foster City CA

G06Q 30/00
G06Q 50/00
G06Q 10/00

705 10, 705 26, 705 15

Systems and methods to consolidate user preferences for a service and make suggestions for options related to the service. In one aspect, a computer-implemented method includes: storing preferences of a plurality of users for a service; storing past options that have been previously selected for the service; in response to a request for the service for a subset of the users, combining the preferences of the subset of the users to generate a preference set for the subset of the users, based on a set of predetermined rules, using a computer; and selecting an option based on the preference set generated for the subset of users and the past options that have been previously selected for the service, using the computer.

63265532, Dec 4, 2001

Jul 14, 1999

9/353249

Pyongwon Yim - Sunnyvale CA
Andrew S. Kao - Fremont CA
Hyung Jai Lee - Cupertino CA

Samsung Electronics, Co., Ltd

H05K 332

174254

A flexible circuit board which can be assembled into a head gimbal assembly of a hard disk drive. The flexible circuit board may have a conductive tab that is electrically connected to a pre-amp pad and a head pad of the circuit board. The head pad may be connected to a head. The conductive tab may be grounded during handling of the flexible circuit board. Any electrostatic discharge on the head may be grounded through the conductive tab.