US Patent:
20080114148, May 15, 2008
Inventors:
Shen Jason Chou - Irvine CA, US
International Classification:
C08G 69/04
Abstract:
A manufacturing method for polyimide resin containing a norbornene group is disclosed. Take Nadic anhydride to react with diamine compound to form dinorbornene polyimide. Then the dinorbornene polyimide reacts with diisocyanate compounds to produce polyimide resin containing a norbornene group. The polyimide resin containing a norbornene group has good adhesion and electrical properties and is applied to glass fiber, copper foil, coating agents, molding materials and adhesives for generating printed circuit boards by hot pressing.