US Patent:
20090184093, Jul 23, 2009
Inventors:
ABHI DESAI - Fremont CA, US
Robert T. Hirahara - San Jose CA, US
Calvin Augason - Los Altos CA, US
International Classification:
B23K 11/00
H05B 3/68
Abstract:
An aluminum heated substrate support suitable for use in high temperature substrate processing systems and method for fabricating the same are provided. In one embodiment, an aluminum heated substrate support can include an aluminum body, a stem coupled to the body and a heating element disposed in the body. The body has an average grain size less than about 250 μm. In some embodiments, the stem to body joint is a fully penetrated lap weld that promotes service life of the substrate support.