Abaneshwar Dr Prasad

6896593, May 24, 2005

Mar 3, 2004

10/792183

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronic Corporation - Aurora IL

B24D007/22

451 41, 451526, 451534, 51297

The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a pore size within about 20 μm of less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 μm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

6899598, May 31, 2005

Mar 3, 2004

10/792344

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronics Corporation - Aurora IL

B24D007/22

451 41, 451526, 451534, 51297

The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a pore size within about 20 μm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 μm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

6913517, Jul 5, 2005

Oct 28, 2002

10/281782

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronics Corporation - Aurora IL

B24D007/22

451 41, 481526, 481534, 51297

The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a pore size within about 20 μm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 μm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

6935931, Aug 30, 2005

Mar 3, 2004

10/792348

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronics Corporation - Aurora IL

B24D007/22

451 41, 451526, 451534, 51297

The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a pore size within about 20 μm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 μm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

6960120, Nov 1, 2005

Feb 10, 2003

10/361520

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronics Corporation - Aurora IL

B24B001/00

451 41, 451 6, 451 8, 451 9, 451286, 451287, 451288, 451526, 451921

The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises about 20 wt. % or more of the transparent window. In another embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 to 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 to 10,000 nm. In yet another embodiment, the transparent window comprises an inorganic/organic hybrid sol-gel material. In an additional embodiment, the transparent window comprises a polymer resin and a clarifying material, wherein the transparent window has a total light transmittance that is substantially higher than a window comprising only the polymeric resin.

6998166, Feb 14, 2006

Jun 17, 2003

10/463730

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronics Corporation - Aurora IL

B32B 27/00
D06N 7/04
B24D 11/00
B24D 3/00

428141, 4284231, 4284251, 4283044, 428338, 428220, 428152, 51296, 51298, 51303, 451527, 451530

The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.

7059936, Jun 13, 2006

Mar 23, 2004

10/807079

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronics Corporation - Aurora IL

B24D 11/00

451 8, 451526

The invention provides a polishing pad substrate comprising a copolymer, wherein the copolymer has at least one hydrophilic repeat unit and at least one hydrophobic repeat unit. The invention also provides a polishing pad substrate comprising a polymer, wherein the polymer is a modified polymer having at least one hydrophilic unit and at least one hydrophobic unit attached to the polymer chain. The invention further provides a method of polishing a workpiece comprising (i) providing a workpiece to be polished, (ii) contacting the workpiece with a chemical-mechanical polishing system comprising the polishing pad substrate of the invention, and (iii) abrading at least a portion of the surface of the workpiece with the polishing system to polish the workpiece.

7195544, Mar 27, 2007

Mar 23, 2004

10/807064

Abaneshwar Prasad - Naperville IL, US

Cabot Microelectronics Corporation - Aurora IL

B24B 49/00

451 41, 451285

The invention provides a polishing pad comprising a polymeric material having pores and a component that is disposed within the pores, as well as a method of polishing a workpiece with the aforesaid polishing pad, and a method for producing the aforesaid polishing pad.