Michael Y Ng

6502869, Jan 7, 2003

Jul 14, 1998

09/115414

Frederick T. Rosenquist - Redwood City CA
Michael Ng - Campbell CA

Asyst Technologies, Inc. - Fremont CA

E05C 502

292 59, 292 57, 292202

A system is disclosed for ensuring that the pod door is firmly and securely retained on the port door of a process tool as the pod door is removed from the pod and stowed in the process tool during workpiece transfer between the pod and process tool. The system includes a latch key protruding outwardly from the outer surface of the port door. The latch key is provided to mate within a slot of a door latch assembly within the pod door. Once the latch key is properly seated within the slot, the latch key is rotated by mechanisms within the port door to decouple the pod door from the pod shell. Such rotation at the same time couples the pod door to the port door. According to the present invention, while the latch key rotates, it simultaneously moves in the rearward direction (i. e. , back toward the port door) to thereby pull the pod door into a tight engagement with the port door.

6663148, Dec 16, 2003

Dec 13, 2001

10/020761

Anthony C. Bonora - Woodside CA
Gary M. Gallagher - Austin TX
Michael Ng - Campbell CA

Entegris, Inc. - Chaska MN

E05C 106

292159, 292DIG 12, 206710, 220324

An apparatus for preventing improper engagement of a pod door and a pod. Specifically, misalignment of at least one latch finger connected t the pod door with latch engagement slots in the pod prevents a pod door from mechanically engaging a pod.

20130221075, Aug 29, 2013

Feb 5, 2013

13/759960

Flextronics AP, LLC - , US
Anthony Aaron Lynn Burton - Sunnyvale CA, US
Michael Ryan Ng - Burlingame CA, US
Mimi Munson Tantillo - San Jose CA, US
Dieu-Huong Nguyen Tran - Santa Clara CA, US

Flextronics AP, LLC - San Jose CA

H05K 1/11

228165, 22818021, 716136

This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

61387215, Oct 31, 2000

Sep 2, 1998

9/145704

Anthony C. Bonora - Menlo Park CA
Edward J. Cortez - San Jose CA
John D. Kyffin - San Jose CA
Michael Ng - Campbell CA

Asyst Technologies, Inc. - Fremont CA

B65B 104

141 98

A tilt and go assembly included as part of a load port interface assembly is disclosed for providing quick and easy attachment and adjustment of the load port interface assembly to a BOLTS interface. When a load port interface assembly according to the present invention is positioned adjacent to a BOLTS interface, the assembly is tilted away from the BOLTS interface, so that a socket in the load port interface assembly may raise upward slightly and be seated on the ball joint. Thereafter, the upper portions of the load port interface assembly may be tilted upward so that the assembly is roughly parallel and adjacent to the BOLTS interface. Once the load port interface assembly is seated on the ball joint of the BOLTS interface, the vertical and lateral positions of the load port interface assembly may be adjusted as desired with respect to the BOLTS interface. Additionally, after the vertical and lateral positions of the load port interface assembly have been adjusted, the azimuth and roll angle of the load port interface assembly may be adjusted with respect to the BOLTS interface.