Lei Zhang

6391220, May 21, 2002

Aug 18, 1999

09/376645

Lei Zhang - San Jose CA
Solomon Beilin - San Carlos CA
Som S. Swamy - Danville CA
James J. Roman - Sunnyvale CA

Fujitsu Limited, Inc.

B32B 3100

216 67, 438694, 438706, 438957, 438968, 438976, 29846, 29849, 156247, 156248, 1562739

Methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer on substrate, and then forming a conductive laminate on the release layer. After the release layer is formed, the conductive laminate can be easily separated by the substrate to eventually form a flexible circuit structure.

6396667, May 28, 2002

May 1, 1998

09/071611

Lei Zhang - San Jose CA
Peter Crane - Richfield MN
Roger A. Resh - Prior Lake MN

Seagate Technology LLC - Scotts Valley CA

G11B 554

3602943

A disc drive has a recording disc rotatable around an axis, a slider supporting a transducing head for transducing data with the disc, and a dual-stage actuation assembly supporting the slider to position the transducing head adjacent a selected radial track of the disc. The dual-stage actuation assembly includes a movable actuator arm, a suspension assembly supported by the actuator arm and including a flexure, a tongue supporting the slider, and a microactuator. The microactuator includes a rotor attached to the tongue and a stator attached to the flexure and operatively connected to the rotor to radially move the rotor with respect to the stator. At least one beam is attached between the slider bond pad and the stator.

6448106, Sep 10, 2002

Nov 9, 1999

09/437736

Wen-chou Vincent Wang - Cupertino CA
Thomas J. Massingill - Scotts Valley CA
Yasuhito Takahashi - San Jose CA
Lei Zhang - San Jose CA

Fujitsu Limited

H01L 2144

438106, 438108

Device modules with pins and methods for making device modules with pins are disclosed. One embodiment is directed to a method including forming a polymeric circuit structure having a first side and a second side on a substrate. The formed first side is adjacent to the substrate. A pin is bonded to the second side of the polymeric circuit structure. At least a portion of the substrate is removed to expose at least a portion of the first side of the polymeric circuit structure, and a device is mounted on the first side of the polymeric circuit structure.

6544430, Apr 8, 2003

May 31, 2001

09/872795

Mark Thomas McCormack - Livermore CA
James Roman - Sunnyvale CA
Lei Zhang - San Jose CA
Solomon I. Beilin - San Carlos CA

Fujitsu Limited

C03C 2568

216 67, 216 40, 216 58, 438697, 438706, 438976, 156246, 156247, 156248, 1562722, 1562726, 1562733, 1562739, 29846, 29849, 427569, 427576, 427579

Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.

6572780, Jun 3, 2003

May 31, 2001

09/872629

Mark Thomas McCormack - Livermore CA
James Roman - Sunnyvale CA
Lei Zhang - San Jose CA
Solomon I. Beilin - San Carlos CA

Fujitsu Limited - Kawasaki

H01B 1300

216 13, 216 20, 156155, 156246, 156247, 156248

Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.

6594106, Jul 15, 2003

Oct 29, 1999

09/429865

Louis Joseph Serrano - San Jose CA
Mantle Man-Hon Yu - San Jose CA
Kirk Barrows Price - San Jose CA
Lei Zhang - San Jose CA

International Business Machines Corporation - Armonk NY

G11B 5596

360 7809, 360 7704

A system and method for adaptively compensating for real-time variations in mechanical dynamics of a head-positioning assembly during track follow and seek operations. The head-positioning assembly includes a voice coil actuator that positions a read/write head utilizing a coil and carriage in conformity with an actuator control signal. Variations in resonant mode characteristics are anticipated in real-time in accordance with measured temperature variations. These parametric variations are translated in real-time by a state space model to determine a secondary velocity and displacement of the read/write head during track follow and seek operations. In response to this secondary velocity and displacement determination, the actuator control signal is dynamically adjusted to compensate for the determined secondary head velocity and displacement, thereby improving head positioning accuracy and increasing servo bandwidth.

6599692, Jul 29, 2003

Sep 14, 1999

09/395448

Casey C. Case - San Mateo CA
Lei Zhang - San Francisco CA

Sangamo BioScience, Inc. - Richmond CA

C12Q 102

435 4, 435 6, 536 231

The present invention provides methods of regulating gene expression using recombinant zinc finger proteins, for functional genomics and target validation applications.

6694603, Feb 24, 2004

Jul 11, 2000

09/613376

Lei Zhang - San Jose CA
Patrick J. Ryan - St. Paul MN
Peter Crane - Richfield MN

Seagate Technology LLC - Scotts Valley CA

G11B 5127

2960303, 29598, 2960314, 2960315, 2960316, 216 39, 216 41, 216 48, 360120, 360121, 360122, 360126

A process of forming a microactuator for positioning a transducing head over a selected radial track of a rotatable disc in a disc drive system is disclosed. A tub is etched in a substrate, and a bottom coil layer is plated at least partially in the tub. A first insulating layer is deposited on the bottom coil layer. A ferromagnetic core layer is formed on the first insulating layer. A second insulating layer is deposited on and around the ferromagnetic core layer. A top coil layer is plated on the second insulating layer, and contacts the bottom coil layer at a point spaced from the ferromagnetic core. A rotor is formed on a rotor substrate to confront the ferromagnetic core, is operatively attached to the slider and is movable with respect to the ferromagnetic core.