Jun Yao Phones & Addresses
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1300 Paseo Grande, Fullerton, CA 92833
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Anaheim, CA
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Cypress, CA
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San Diego, CA
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Hightstown, NJ
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New York, NY
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Orange, CA
Business Records
Name / Title
Company / Classification
Phones & Addresses
President
Barbara Wang North America Inc
3301 Ocean Park Blvd, Santa Monica, CA 90405
Vit Group, LLC
Real Estate Investment
Real Estate Investment
8914 Garvey Ave, Rosemead, CA 91770
President
MEMCENTRIC TECHNOLOGIES, INC
2643 W 225 St, Torrance, CA 90505
Publications
Us Patents
Microelectromechanical System (Mems) With Improved Beam Suspension
View pageUS Patent:
6803755, Oct 12, 2004
Filed:
Oct 25, 2001
Appl. No.:
10/001412
Inventors:
Patrick C. Herbert - Mentor OH
Jeffrey R. Annis - Waukesha WI
Jun J. Yao - San Diego CA
Winfred L. Morris - Thousand Oaks CA
Henric Larsson - Oak Park CA
Richard D. Harris - Solon OH
Robert J. Kretschmann - Bay Village OH
Jeffrey R. Annis - Waukesha WI
Jun J. Yao - San Diego CA
Winfred L. Morris - Thousand Oaks CA
Henric Larsson - Oak Park CA
Richard D. Harris - Solon OH
Robert J. Kretschmann - Bay Village OH
Assignee:
Rockwell Automation Technologies, Inc. - Mayfield Heights OH
International Classification:
G01R 3302
US Classification:
324 99R, 324259, 324260, 3241581
Abstract:
In a MEMS device employing a beam supported by transverse arms, potential bowing of the transverse arms caused by fabrication processes, temperature or local self-heating from resistive losses is accommodated by flexible terminations of the transverse arms. Alternatively, this bowing is controlled so as to provide selective biasing to the beam or mechanical advantage in the sensing of beam motion.
Microelectricalmechanical System With Improved Beam Suspension
View pageUS Patent:
7049806, May 23, 2006
Filed:
Sep 27, 2004
Appl. No.:
10/950886
Inventors:
Patrick C. Herbert - Mentor OH, US
Jeffrey R. Annis - Waukesha WI, US
Jun J. Yao - San Diego CA, US
Winfred L. Morris - Thousand Oaks CA, US
Henric Larsson - Oak Park CA, US
Richard D. Harris - Solon OH, US
Robert J. Kretschmann - Bay Village OH, US
Jeffrey R. Annis - Waukesha WI, US
Jun J. Yao - San Diego CA, US
Winfred L. Morris - Thousand Oaks CA, US
Henric Larsson - Oak Park CA, US
Richard D. Harris - Solon OH, US
Robert J. Kretschmann - Bay Village OH, US
Assignee:
Rockwell Automation Technologies, Inc. - Mayfield Heights OH
International Classification:
G01R 33/02
US Classification:
324 99R, 3241581, 324259, 324260
Abstract:
In a MEMS device employing a beam supported by transverse arms, potential bowing of the transverse arms caused by fabrication processes, temperature or local self-heating from resistive losses is accommodated by flexible terminations of the transverse arms. Alternatively, this bowing is controlled so as to provide selective biasing to the beam or mechanical advantage in the sensing of beam motion.
Method For Fabricating Microelectromechanical System (Mems) Devices
View pageUS Patent:
7346981, Mar 25, 2008
Filed:
Jun 2, 2003
Appl. No.:
10/453031
Inventors:
Philip A. Stupar - Oxnard CA, US
Jeffrey F. DeNatale - Thousand Oaks CA, US
Jun J. Yao - San Diego CA, US
Sangtae Park - Sugar Land TX, US
Jeffrey F. DeNatale - Thousand Oaks CA, US
Jun J. Yao - San Diego CA, US
Sangtae Park - Sugar Land TX, US
Assignee:
Teledyne Licensing, LLC - Thousand Oaks CA
International Classification:
H05K 3/10
US Classification:
29846, 29825, 29830, 361277, 361278, 361280, 361281, 438689, 438694, 438697, 216 11, 216 33, 216 36, 216 80
Abstract:
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the substrate overlying the patterned layer of material; selectively removing portions of the wafer from the side opposite the one side to define stationary and movable MEMS elements; and selectively removing the adhesive bonding agent to release the movable MEMS element, at least a portion of the layer of material being disposed so as to be attached to the movable MEMS element.